The wetting properties of the aqueous solutions used for these processes have to be characterized, as regard with the structures nominal dimensions (from 50nm for Contacts Holes up to 10µm for “Thru Silicon Vias” (TSV) used in 3D Hybrid bonding approaches), structure geometry (holes or trenches arrays), material surface energy before / after wet process (hydrophobic and hydrophilic surfaces), liquid surface tension and viscosity, dynamic aspects of the wet clean process (liquid flow, wafer rotation speed, …).

More information : MAMINA BioMEMS ST acoustic wetting charac 2016